Tungsten alloy microelectronics technology is developed in the late 20th century; it is a series of special technology such as the system circuit design, device physics, process technology, material preparation, automatic testing and packaging, assembly semiconductor technology, integrated circuit technology and so on. Tungsten heavy alloy microelectronic technology refers to design and manufacture and use the small electronic components and circuits. Tungsten alloy microelectronic is developed based on integrated circuit technology.
A chemical etchant (and a method for forming the etchant) is disclosed for removing thin films of titanium-tungsten alloy microelectronic chip fabrication. The tungsten heavy alloy microelectronic removed is preferably 10% Ti and 90% W, which is layered onto a substrate under chromium and copper seed layers for electrode position of C4 solder bumps. Tungsten heavy alloy microelectronic products are widely used in computers and other machines.
In the application of tungsten heavy alloy microelectronic the Ti--W etchant should not attack aluminum, chromium, copper, or lead-tin solders, and should dissolve Ti--W rapidly. The invention achieves this with a mixture of 30% by weight hydrogen peroxide and water, to which is added EDTA and potassium sulfate.Tungsten heavy alloy microelectronic products vary in side and shape.
The society advocate sustainable development, tungsten alloy is the perfect material to produce tungsten heavy alloy microelectronic products. The property of high temperature resistance is another reason for manufacturers to choose tungsten alloy as the material to produce tungsten heavy alloy
microelectronic products. When the tungsten heavy alloy microelectronic products are used, they produce a lot of heat, many of the products made by other materials can not exist. We can provide all kinds of tungsten alloy microelectronic products according to your requirements.